EETimes.com - How much of a lead does Intel have at 32nm?
We plotted (Figure 1 online) the minimum interconnect line pitch for all three manufacturers as a function of the technology node. All three players had comparable critical dimensions, illustrating that Moore's law is alive and well with no sign of slowing.
Interestingly, TSMC has slightly smaller dimensions than the two other manufacturers, probably because TSMC's customers are mainly SoC manufacturers, such as graphics processor and FPGA makers. With the latest graphics processors having more than a billion transistors, any reduction in chip size is highly beneficial to foundry clients, even though the individual transistors may not be as fast as Intel's or AMD's.
Every new technology node both reduces critical dimensions and improves process. Two fundamental process innovations being adopted by the main semiconductor companies are embedded silicon-germanium source/drain regions (eSiGe) and high-k metal gate technology (HKMG). eSiGe increases the performance of the slower type of transistors (PMOS), while HKMG helps the transistors switch faster and reduces the gate leakage.
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